Advanced Packaging Process Engineer (Semiconductor / Senior OR Executive Level)

• 5 days work week
• Location : North East
• AWS & VB provided
Industry: Electronics & Semiconductor Manufacturing

What You’ll Do

• Spearhead the development of advanced packaging technologies and processes for next-gen electronic devices.
• Conduct Design of Experiments (DOE) to optimize semiconductor assembly processes.
• Perform failure mode analysis using a suite of advanced analytical tools (SEM/EDX, C-SAM, AFM, etc.).
• Collaborate closely with internal R&D, product, and engineering teams to translate innovation into practical manufacturing solutions.
• Partner with external customers and global partners to provide technical support and co-develop breakthrough technologies.
• Contribute to simulation activities using ANSYS or ABAQUS for stress and thermal analysis (preferred).

What You Bring

• Preferably MPhil or PhD in Material Science, Physics, Engineering, or related disciplines.
• Preferably at least around 3-5 years relevant work experience in semiconductor industry
• Prior experience with semiconductor assembly equipment and front-end/back-end process development is advantageous.
• Knowledgeable in using analytical and imaging equipment for material characterization and defect analysis.
• A background in simulation modeling is a plus.
• Strong communication skills, a collaborative mindset, and a self-driven attitude.

To Apply, kindly click on the "APPLY NOW" button.
We regret that only shortlisted candidates will be notified.

Staffking Pte Ltd (20C0358) | Chong Kar Ming (John) (R21101412)