SMTS ULP CMOS Advanced Packaging D2W Integrator

GLOBALFOUNDRIES


Date: 1 day ago
Area: Singapore, Singapore
Contract type: Full time
Develop process flows and process recipes to enable meeting the product requirements for performance, reliability and defect free manufacturing Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:
  • Responsible for developing process flows and process recipes to enable meeting the product requirements for performance, reliability and defect free manufacturing.
  • Ensure methods and processes in place to test the devices and structures being developed
  • Develops and implements methods and procedures for process control and inspection to ensure that the products are free of flaws and function as designed
  • Analyzes reports and defective products to determine trends and recommend corrective actions
  • Responsible to freeze developed processes in preparation for manufacturing
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements
  • Work and collaborate other projects and/or assignments as needed
See description for career level for general proficiency levels pertaining to Job Complexity, Accountability, Relationship Focus, and Knowledge, Skills & Abilities. These proficiency levels apply to all career levels. Some requirements may vary locally.

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role: The ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team in our Singapore facility. Applicants for this position would be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process demonstration through manufacturing transfer. Areas of focus could include die-to-wafer and wafer-to-wafer integration bonding.

Essential Responsibilities:

  • Responsible for leading complex development integration initiatives to meet customer and technology requirements to further GF advanced packaging strategy.

  • Leading creation of process flows and process recipes to enable meeting the product requirements for performance, reliability and defect free manufacturing.

  • Ensure methods and processes in place to test the devices and structures being developed

  • Develops and implements methods and procedures for process control and inspection to ensure that the products are free of flaws and function as designed

  • Identify issues and technical challenges, formulate appropriate experiments to understand root cause and improve processes to meet requirements.

  • Analyze various data, physical, electrical or defect reports to determine trends and recommend corrective actions

  • Lead and execute develop continual improvement through the product development process through to eventual manufacturing transfer; including freeze developed processes in preparation for manufacturing and meet all product requirements.

  • May require creation of presentations to provide occasional management or external customer updates.

  • Work and collaborate other projects and/or assignments as needed

Other Responsibilities:

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

  • Travel <10% to other GlobalFoundries facilities may be necessary

Required Qualifications:

  • Education –BS and above. Electrical Engineering or related field.

  • Bachelor of Science (B.S.) or equivalent degree in Electrical Engineering, Material Science or a related field from an accredited university.

  • Additional professional experience in advanced module development, integration and/or advanced packaging:

    • B.S. + minimum of 8 years of relevant experience

    • M.S. + minimum of 7 of relevant experience

    • Ph.D. + minimum of 5 of relevant experience

  • Skills: Familiarity with integration skills including lot handling, DOE, inline/HOL/ET analysis and monitoring. Strong communication and coordination skills cross the department and cross-organizationally. Strong team collaborator across multiple geographical locations & proactive mindset.

  • Fluency in English Language – written & verbal

Preferred Qualifications:

  • Project management skills - i.e., the ability to innovate and execute solutions that matter; the ability to navigate ambiguity and communicate and track projects through to completion.

  • Strong written and verbal communication skills.

  • Strong planning & organizational skills.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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