Process Associate Engineer (Polishing)

Job scope:

• Re-qualify tools according to post Preventive Maintenance (PM) and Corrective Maintenance (CM) qualification plans

• Execute Out of Control Action Plans (OCAPs) and process-based corrective/preventive actions in response to Out of Control (OOC), Out of Specifications (OOS) or process abnormality events

• Provide timely updates to passdown logs with accurate information and details for every incident or instruction given by the Process Engineer (PE) or Equipment Engineer (EE)

• Prepare and present daily reports on production line health and performance metrics (e.g. SPC, hold lot reviews)

• Take ownership of simple processes or measurement tools where necessary

• Lead and/or participate in process and/or operational improvement projects

Requirements:

• Min. Diploma in any engineering field, preferably related to semiconductor manufacturing or materials engineering

• Experience in semiconductor wafer fabrication/manufacturing in a cleanroom environment.

• Knowledge of Bonding, Cleaning and Polishing processes is advantageous

• Team player with a positive attitude and willingness to learn

• Proficient in Microsoft Office applications (Word, Excel, PowerPoint)

• Familiarity with SiView/JMP software is an added advantage