Semicon Chip R&D Vice President

Chip R&D Vice President (VP)- Based in Shenzhen/Hong Kong (Shanghai/Chengdu also acceptable)

芯片研发- 副总裁（VP）｜深圳 香港（可上海/成都）

Salary- RMB 3.5-4 million/year

I. Job Overview

The company is at a critical stage of high-performance processor chip R&D and industrialization, and is now recruiting a Vice President (VP) for Chip R&D globally. As one of the company's core technology leaders, this position will be responsible for the overall R&D management of large-scale chip products, leading the team to complete the entire process from architecture design to mass production, and driving the company's next-generation processor products to achieve commercial breakthroughs.

Reporting to: CEO Work

Location: Shenzhen (Shanghai/Chengdu also acceptable)

II. Core Responsibilities

1. Chip R&D System Construction Responsible for the company's large-scale chip product R&D strategic planning and technology roadmap formulation;

2. Coordinate the management of chip front-end, back-end, verification, and software R&D teams; Establish and optimize R&D processes, quality systems, and project management mechanisms.

3. Product Lifecycle Management Lead the entire process of high-performance processor chip development, from definition, architecture design, RTL development, verification, physical implementation to tape-out and mass production deployment; Drive chip products to complete tape- out, packaging, testing, and mass production delivery on schedule;

4. Coordinate upstream and downstream partners and fab resources.

5. Technical Team Building Build and cultivate an international chip R&D team; Attract and manage high-end technical talent; Establish a technical talent pipeline and core R&D capabilities.

6. Technical Decision-Making and Risk Control Participate in major technical roadmap and product planning decisions; Lead the tackling of key technologies; Control R&D risks and ensure timely project delivery.

III. Qualifications Education Background

Master's degree or above from a 985 university; Overseas renowned university background preferred; Major in Computer Science, Microelectronics, Integrated Circuits, Communication Engineering, or related fields.

Core Technical Requirements (Hard Requirements)

Required Experience: Leaded large-scale chip (CPU, GPU, AI chip, or high-end communication chip) R&D projects; Have complete chip R&D and successful tape-out experience; Deeply involved in: Chip project initiation Architecture design RTL development Verification Backend implementation Tape-out Fab implementation and mass production Successful case studies of building chip products from scratch.

Preferred Company Background:

Preferred candidates are from the following companies: leading chip companies

Management Experience: Managing a R&D team of over 100 people is preferred;

Experience in cross-departmental collaborative management; Experience in R&D management at startups or fast-growing companies is preferred.

Long-term technical accumulation and strong entrepreneurial spirit; Allowance to adopt innovative corporate development models.

IV. Team and Business Status

R&D Team The R&D team consists of approximately 120-130 people; over 50% of members have overseas experience; a complete R&D system has been established, including: Chip Architecture, Front-End, RTL Design, Verification, Physical Design, and Software. Product Progress The company has successfully released its self-developed processor product; currently in the critical stage of mass production introduction; large-scale mass production is expected to be achieved by the end of 2026 to the first half of 2027.

V. Compensation and Incentives

Components: 12 months fixed salary + 6 months performance bonus

Long-term Incentives: Stock options (with significant growth potential)

VI. Special Notes If a qualified full-stack VP-level talent cannot be found, the company may consider adopting a "Dual Director Model": Front-End Director Back-End Director Both share VP responsibilities, achieving comprehensive technical capabilities