Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)

Key Responsibilities

Leadership Responsibilities

Leadership Development: By coaching and providing career development, this role ensures the growth of future leaders in the semiconductor industry, which is vital for driving innovation and technological advancement.

Skill Enhancement: The role involves identifying strengths and creating specific development plans to improve skills. This continuous skill enhancement is crucial to keep up with the rapidly evolving technology landscape.

Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Technical Responsibilities

Test Coverage for DPM Reduction: Accountable for improving assembly related coverage within the manufacturing flows to reduce the Time 0 and package failure DPM and reduce/prevent inline fallout within the assembly process. Work on electrical failure analysis and screens/stress development (DFT) for Time0 coverage.

Yield improvement with Electrical Failure Analysis: Improving HBM yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield. Understand of inspection fail defects and testing to enhance electrical test coverages.

Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures in by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration on test coverages and process improvement.

Subject Matter Expert: Serve as the go-to expert in your domain field, providing guidance and insights to support decision-making and strategy development.

Leading Complex Projects: Define and drive critical multi-disciplinary projects to ensure successful execution and completion.

Organization Spokesperson and Expert: Act as the main contact and expert, providing detailed analysis on project and technical issues.

Developing Future Leaders: Coach and mentor team members to foster the growth of future technical leaders in the organization.

Innovation and Improvement: Continuously seek and implement innovative solutions to improve processes and technologies.

Requirements

Bachelors/Masters of Electrical/Electronic/Mechanical Engineering Degree with more than 12 years of experience in the semiconductor industry. Product Engineering and Packaging Experience is preferred.

Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis. Candidate with proven leadership in technical role is preferred.

Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

Strong sense of responsibility and accountability towards assigned role with professional work ethic.

Excellent communication, collaboration and presentation skills.

Passionate about people and technical leadership, with a drive toward ongoing learning and development in this area.