Dry Etch - MTS, PD, Advance NAND

As a MTS (Member of Technical Staff) at Micron, you will join a groundbreaking Next Generation NAND research and development Dry Etch team. You will lead critical modules listed below. This position provides many opportunities for creativity, collaboration, and advancing scaling with Next Generation NAND. You will work closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will operate powerful dry etch chambers and manage the process roadmap to achieve program and yield goals. Your responsibilities include, but are not limited to:

Leading development of Dry Etch technology and essential modules

• Become a Dry Etch Area expert

• Develop/innovate dry etch processes to meet structural and electrical specifications

• Work closely with hardware teams to develop the equipment roadmap for current and upcoming NAND products

• Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes

• Collaborate and lead multi-functional teams to solve complex structural problems

• Present process and technology development plans for current and upcoming technology nodes

• Stay proactive in predicting when and how future issues could arise and build mitigation plans

• Contribute towards Technical Leadership Program

• Mentor less-experienced engineers and encourage skills within the team

• Work on critical modules such as HAR, tier-by-tier etches, WL contacts & staircase

Collaboration with other Process Areas

• Find opportunities & drive towards collaborative solutions

• Guide other areas' technology roadmaps

• Lead or be part of multi-functional task force groups driving towards a target

• Gain general expertise in other areas' process hardware or technologies

Interaction with Dry Etch peers

• Serve as a resource and guide for colleagues in dry etch technology and/or project management

• Provide critical updates to upper management on project status and impacts

Successful candidates for this position will have:

• Demonstrated interest in research and development environment

• 6-10 years’ experience in dry etch process development in R&D moving into manufacturing

• 4-5 years of pertinent experience in NAND, DRAM, or Logic module development, such as projects and deliveries involving multi-functional groups

• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework

• Demonstrated leadership in problem-solving. Experience in managing technical projects

• Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)

• Expertise in statistical process control and analysis

• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes

• Lead supplier head-to-heads

• Data science basics / Python coding / AI coders shall be preferred over candidates without this experience

• Strong computer skills, including MS Office, and SAS software like JmP and similar

Education

• PhD or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or related fields with a minimum of 10 years’ experience in dry etch process development.

• Bachelors/Masters (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or related fields) with a minimum of 12 years of applicable dry etch process development experience